Low-Temp. Die Attach Paste
  • Low-Temp. Die Attach Paste

  • Low-Temp. Die Attach Electrical/Thermal Conductivity Ag Paste The high electrical& thermal conductivity as well as the chemical stability under room temperature of Ag makes the Ag paste indispensable in the electronic industry nowadays. GIGASTORAGE’s low-temp. Ag paste has the property of high electrical/thermal conductivity, and with its special resin formula, it demonstrates outstanding adhesive force and can be widely applied to the packaging process for the electronic as well as energy industries.
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LED solid crystal, and a conductive connection to other electronic materials.



Product Features

☉ Low thermal resistance / high thermal conductivity

Proper use of silver particles and polymer resin formulations stack, to achieve high thermal conductivity and low resistivity targets.

☉ Thrust and tensile strength

High shear strength and bond strength.

☉ Curing conditions can be recipe adjustment

May, upon customized requirements, adjust formula, in line with the client process required curing temperature and time.